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Hitachi LMG6911RPBC-E

# LMG6911RPBC-E Hitachi LMG6911RPBC-E New LMG6911RPBC KOE 5.7 inch LCM 320×240 6:1 Monochrome CCFL Parallel Data, LMG6911RPBC-E pictures, LMG6911RPBC-E price, #LMG6911RPBC-E supplier ------------------------------------------------------------------- Email: sales@shunlongwei.com https://www.slw-ele.com/lmg6911rpbc-e.html ------------------------------------------------------------------- Panel Brand:  HITACHI Panel Model : LMG6911RPBC   Panel Size : 5.7 inch Panel Type STN- LCD , LCM  Resolution: 320×240 , Q VGA   Pixel Format Rectangle Display Area: 115.17(W)×86.37(H) mm Bezel Opening 122.0(W)×90.0(H) mm Outline Size 167.1(W)×109(H) mm Brightness - Contrast Ratio 6:1 (Typ.) (TM)     Viewing Angle - Display Mode STN, Blue mode (Negative), Transmissive  IP

How to prevent deformation during slow wire processing

 Slow-moving wire processing is a very exquisite and exquisite craft, and sufficient preparations need to be made, so that the processed products can be more quality. The slow-moving wire processing technology has a wide range of applications and is a must in our industries. If you want to do better with less technology, you must master all aspects of the processing knowledge. For example, the most common thing is the deformation during processing.  How can we solve it How to prevent deformation during slow wire processing Speaking of slow wire processing, it uses continuously moving fine metal wires as electrodes. Pulse spark discharge is performed on the workpiece, where it generates a high temperature above 6000 degrees. Moreover, if it wants to improve its quality problems and prevent its deformation, it can firstly start from the following aspects. 1. To prevent deformation, it is impossible for the material to have no internal stress. In particular, the internal stress of the que

Introduction of KOVAR parts

KOVAR parts are commonly used as metal casing materials in the electronic packaging industry. Because they have a linear expansion coefficient close to that of molybdenum group glass, and can produce less sealing stress during the sealing (melting) process with molybdenum group glass, so To obtain good air-tightness, in order to make the metal tube and shell to achieve air-tight sealing, in the entire sealing process, the annealing process undoubtedly plays an important role as a link between the previous and the next. The internal stress generated during KOVAR  machining also prepares the material structure for the implementation of the subsequent process-the sealing process of the metal parts. The main purpose of annealing Kovar shell before sealing is to: (1) Eliminate machining stress. When Kovar undergoes plastic machining deformation during cold working, about 10% to 15% of the applied energy is converted into internal energy, which is commonly referred to as internal stress,

Infineon FF900R12IE4

Infineon FF900R12IE4
#FF900R12IE4 Infineon FF900R12IE4 New PrimePACK™ 2 1200 V 900 A half-bridge dual IGBT module with TRENCHSTOP™ IGBT4 Emitter Controlled 4 Diode NTC and fast switching chip. Also available with pre-applied Thermal Interface Material. , FF900R12IE4 pictures, FF900R12IE4 price, #FF900R12IE4 supplier
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Email: sales@shunlongwei.com

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Summary of Features
 
Extended operation temperature Tvj op
High DC stability
High short circuit capability, self limiting short circuit current
Low switching losses
Unbeatable robustness
VCEsat with positive temperature coefficient
4 kV AC 1 min insulation
Package with CTI > 400
High creepage and clearance distances
High power and thermal cycling capability
Substrate for low thermal resistance
UL recognized,

Applications
Motor control and drives
Traction
Uninterruptible Power Supply (UPS)
Wind energy systems


PrimePACK™ 2 1200 V 900 A half-bridge dual IGBT module with TRENCHSTOP™ IGBT4 Emitter Controlled 4 Diode NTC and fast switching chip. Also available with pre-applied Thermal Interface Material.

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