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Hitachi LMG6911RPBC-E

# LMG6911RPBC-E Hitachi LMG6911RPBC-E New LMG6911RPBC KOE 5.7 inch LCM 320×240 6:1 Monochrome CCFL Parallel Data, LMG6911RPBC-E pictures, LMG6911RPBC-E price, #LMG6911RPBC-E supplier ------------------------------------------------------------------- Email: sales@shunlongwei.com https://www.slw-ele.com/lmg6911rpbc-e.html ------------------------------------------------------------------- Panel Brand:  HITACHI Panel Model : LMG6911RPBC   Panel Size : 5.7 inch Panel Type STN- LCD , LCM  Resolution: 320×240 , Q VGA   Pixel Format Rectangle Display Area: 115.17(W)×86.37(H) mm Bezel Opening 122.0(W)×90.0(H) mm Outline Size 167.1(W)×109(H) mm Brightness - Contrast Ratio 6:1 (Typ.) (TM)     Viewing Angle - Display Mode STN, Blue mode (Negative), Transmissive  IP

How to prevent deformation during slow wire processing

 Slow-moving wire processing is a very exquisite and exquisite craft, and sufficient preparations need to be made, so that the processed products can be more quality. The slow-moving wire processing technology has a wide range of applications and is a must in our industries. If you want to do better with less technology, you must master all aspects of the processing knowledge. For example, the most common thing is the deformation during processing.  How can we solve it How to prevent deformation during slow wire processing Speaking of slow wire processing, it uses continuously moving fine metal wires as electrodes. Pulse spark discharge is performed on the workpiece, where it generates a high temperature above 6000 degrees. Moreover, if it wants to improve its quality problems and prevent its deformation, it can firstly start from the following aspects. 1. To prevent deformation, it is impossible for the material to have no internal stress. In particular, the internal stress of the que

Introduction of KOVAR parts

KOVAR parts are commonly used as metal casing materials in the electronic packaging industry. Because they have a linear expansion coefficient close to that of molybdenum group glass, and can produce less sealing stress during the sealing (melting) process with molybdenum group glass, so To obtain good air-tightness, in order to make the metal tube and shell to achieve air-tight sealing, in the entire sealing process, the annealing process undoubtedly plays an important role as a link between the previous and the next. The internal stress generated during KOVAR  machining also prepares the material structure for the implementation of the subsequent process-the sealing process of the metal parts. The main purpose of annealing Kovar shell before sealing is to: (1) Eliminate machining stress. When Kovar undergoes plastic machining deformation during cold working, about 10% to 15% of the applied energy is converted into internal energy, which is commonly referred to as internal stress,

Infineon BSM100GD120DN2

Infineon BSM100GD120DN2
#BSM100GD120DN2 Infineon BSM100GD120DN2 New IGBT: 100A 1200V; IGBT Modules 1200V 100A FL BRIDGE , BSM100GD120DN2 pictures, BSM100GD120DN2 price, #BSM100GD120DN2 supplier
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Email: sales@shunlongwei.com

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BSM100GD120DN2
Manufacturer: Infineon
Product Category: IGBT Modules
RoHS: YES
Brand: Infineon Technologies
Product: IGBT Silicon Modules
Configuration: Hex
Collector- Emitter Voltage VCEO Max: 1200 V
Collector-Emitter Saturation Voltage: 2.5 V
Continuous Collector Current at 25 C: 150 A
Gate-Emitter Leakage Current: 400 nA
Pd - Power Dissipation: 680 W
Package / Case: EconoPACK 3A
Maximum Operating Temperature: + 150 C
Maximum Gate Emitter Voltage: 20 V
Minimum Operating Temperature: - 40 C
Mounting Style: Screw
Factory Pack Quantity: 10

IGBT: 100A 1200V; IGBT Modules 1200V 100A FL BRIDGE

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