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How to prevent deformation during slow wire processing

 Slow-moving wire processing is a very exquisite and exquisite craft, and sufficient preparations need to be made, so that the processed products can be more quality. The slow-moving wire processing technology has a wide range of applications and is a must in our industries. If you want to do better with less technology, you must master all aspects of the processing knowledge. For example, the most common thing is the deformation during processing.  How can we solve it How to prevent deformation during slow wire processing Speaking of slow wire processing, it uses continuously moving fine metal wires as electrodes. Pulse spark discharge is performed on the workpiece, where it generates a high temperature above 6000 degrees. Moreover, if it wants to improve its quality problems and prevent its deformation, it can firstly start from the following aspects. 1. To prevent deformation, it is impossible for the material to have no internal stress. In particular, the internal stress of the que

KOVAR parts seal preparation and physical properties

Kovar® is a vacuum-melted iron-nickel-cobalt low-expansion alloy. The chemical composition content is controlled in a very narrow range to ensure accurate and balanced thermal expansion performance. At the same time, strict quality control during the manufacturing process of KOVAR machining parts also ensures balance Its physical and mechanical properties are more suitable for deep drawing, stamping and various cutting processes. Material use Kovar® is used for vacuum sealing of hard glass and ceramics, and is widely used in electron tubes, microwave tubes, transistors and diodes. On integrated circuits, it is used for flat integrated circuits and dual in-line packages. Seal preparation All parts made by Kovar® should be degassed and annealed in a wet hydrogen atmosphere. Hydrogen is injected into water at room temperature and gets wet through blisters. Care must be taken to prevent surface carbonization. The heat treatment furnace must have a cooling chamber that provides the same a

What are the rules for metal stamping die scrap tube?

The Purpose Standardize the management of the scrapping of the company's metal stamping dies, prevent the loss of company assets, and formulate this system specially. Scope of application It is suitable for the management of the company's scrap molds. Definition If the molds listed in the assets of the company fall under one of the following circumstances, the use management department may apply for scrapping. 1. Molds that exceed the specified service life. 2. The mold is severely damaged by accidents or accidents, and molds that cannot be repaired or have no repair value. 3. Metal stamping dies that have not reached the service life, but due to safety, quality, efficiency and other issues, the repair still fails to meet the minimum requirements of the customer's product process or affects the production safety and efficiency. 4. Product customers have stopped placing orders or have not placed orders for molds in several years. 4. Responsibilities 1. Responsibilities of th

TI TMS320C6713BGDPA200

TI TMS320C6713BGDPA200
#TMS320C6713BGDPA200 TI TMS320C6713BGDPA200 New DSP Floating-Point 32bit 200MHz 1600MIPS 272-Pin BGA , TMS320C6713BGDPA200 pictures, TMS320C6713BGDPA200 price, #TMS320C6713BGDPA200 supplier
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Email: sales@shunlongwei.com

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EU RoHSSupplier Unconfirmed 
Instruction Set ArchitectureAdvanced VLIW
Numeric and Arithmetic FormatFloating-Point
Data Bus Width (bit)32
Device Million Instructions per Second (MIPS)1600
Program Memory TypeROMLess
ProgrammabilityNo
Device Input Clock Speed (MHz)200
Minimum Operating Supply Voltage (V)1.14|3.13
Typical Operating Supply Voltage (V)1.2|3.3
Maximum Operating Supply Voltage (V)3.47|1.32
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)105
Supplier Temperature GradeExtended
Pin Count272
Supplier PackageBGA
Standard Package NameBGA
MountingSurface Mount
Package Height1.78
Package Length27
Package Width27
PCB changed272
Lead ShapeBall

DSP Floating-Point 32bit 200MHz 1600MIPS 272-Pin BGA

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