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Hitachi LMG6911RPBC-E

# LMG6911RPBC-E Hitachi LMG6911RPBC-E New LMG6911RPBC KOE 5.7 inch LCM 320×240 6:1 Monochrome CCFL Parallel Data, LMG6911RPBC-E pictures, LMG6911RPBC-E price, #LMG6911RPBC-E supplier ------------------------------------------------------------------- Email: ------------------------------------------------------------------- Panel Brand:  HITACHI Panel Model : LMG6911RPBC   Panel Size : 5.7 inch Panel Type STN- LCD , LCM  Resolution: 320×240 , Q VGA   Pixel Format Rectangle Display Area: 115.17(W)×86.37(H) mm Bezel Opening 122.0(W)×90.0(H) mm Outline Size 167.1(W)×109(H) mm Brightness - Contrast Ratio 6:1 (Typ.) (TM)     Viewing Angle - Display Mode STN, Blue mode (Negative), Transmissive  IP

How to prevent deformation during slow wire processing

 Slow-moving wire processing is a very exquisite and exquisite craft, and sufficient preparations need to be made, so that the processed products can be more quality. The slow-moving wire processing technology has a wide range of applications and is a must in our industries. If you want to do better with less technology, you must master all aspects of the processing knowledge. For example, the most common thing is the deformation during processing.  How can we solve it How to prevent deformation during slow wire processing Speaking of slow wire processing, it uses continuously moving fine metal wires as electrodes. Pulse spark discharge is performed on the workpiece, where it generates a high temperature above 6000 degrees. Moreover, if it wants to improve its quality problems and prevent its deformation, it can firstly start from the following aspects. 1. To prevent deformation, it is impossible for the material to have no internal stress. In particular, the internal stress of the que

What are the rules for metal stamping die scrap tube?

The Purpose Standardize the management of the scrapping of the company's metal stamping dies, prevent the loss of company assets, and formulate this system specially. Scope of application It is suitable for the management of the company's scrap molds. Definition If the molds listed in the assets of the company fall under one of the following circumstances, the use management department may apply for scrapping. 1. Molds that exceed the specified service life. 2. The mold is severely damaged by accidents or accidents, and molds that cannot be repaired or have no repair value. 3. Metal stamping dies that have not reached the service life, but due to safety, quality, efficiency and other issues, the repair still fails to meet the minimum requirements of the customer's product process or affects the production safety and efficiency. 4. Product customers have stopped placing orders or have not placed orders for molds in several years. 4. Responsibilities 1. Responsibilities of th

Infineon FS450R07A2P2_B31

Infineon FS450R07A2P2_B31
#FS450R07A2P2_B31 Infineon FS450R07A2P2_B31 New Introduction of Infineon`s 12 inch wafer fab locations in Villach Austria and Dresden Germany in addition to Infineon's 8 inch wafer fab location in Villach Austria., FS450R07A2P2_B31 pictures, FS450R07A2P2_B31 price, #FS450R07A2P2_B31 supplier

IGBT Module:FS450R07A2P2_B31
Please find attached our INFINEON Technologies PCN:
Introduction of Infineon`s 12 inch Wafer Fab Locations in Villach, Austria and Dresden, Germany in addition to Infineon’s 8 inch Wafer Fab Location in Villach, Austria
Important information for your attention:
 Please respond to this PCN by indicating your decision on the approval form, sign it and return to your sales
partner before 05. March 2018.
 Infineon aligns with the widely-recognized JEDEC STANDARD “JESD46“, which stipulates:
“Lack of acknowledgement of the PCN within 30 days constitutes acceptance of the change.”
Your prompt reply will help Infineon Technologies to assure a smooth and well executed transition. If Infineon does not hear from your side by the due date, we will assume your full acceptance to this proposed change and its implementation.
Your attention and response to this matter is greatly appreciated.

Introduction of Infineon`s 12 inch wafer fab locations in Villach Austria and Dresden Germany in addition to Infineon's 8 inch wafer fab location in Villach Austria.

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