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Working principle of slow wire processing

 Slow wire walking, also called low-speed wire walking, is a kind of CNC machining machine tool that uses continuously moving fine metal wire as an electrode to pulse spark discharge on the workpiece to generate a high temperature of over 6000 degrees, ablate metal and cut into a workpiece. The principle of wire processing is the phenomenon that there is a gap between the wire electrode and the workpiece, and the metal is removed by continuous discharge. Since the slow-moving wire cutting machine adopts the method of wire electrode continuous feeding, that is, the wire electrode is processed during the movement, so even if the wire electrode is worn out, it can be continuously supplemented, so it can improve the machining accuracy of the parts and slow the wire. The surface roughness of the workpiece processed by the cutting machine can usually reach Ra=0.8μm and above, and the roundness error, linear error and dimensional error of the slow-moving wire cutting machine are much bett...

What are the rules for metal stamping die scrap tube?

The Purpose Standardize the management of the scrapping of the company's metal stamping dies, prevent the loss of company assets, and formulate this system specially. Scope of application It is suitable for the management of the company's scrap molds. Definition If the molds listed in the assets of the company fall under one of the following circumstances, the use management department may apply for scrapping. 1. Molds that exceed the specified service life. 2. The mold is severely damaged by accidents or accidents, and molds that cannot be repaired or have no repair value. 3. Metal stamping dies that have not reached the service life, but due to safety, quality, efficiency and other issues, the repair still fails to meet the minimum requirements of the customer's product process or affects the production safety and efficiency. 4. Product customers have stopped placing orders or have not placed orders for molds in several years. 4. Responsibilities 1. Responsibilities of th...

Introduction of KOVAR parts

KOVAR parts are commonly used as metal casing materials in the electronic packaging industry. Because they have a linear expansion coefficient close to that of molybdenum group glass, and can produce less sealing stress during the sealing (melting) process with molybdenum group glass, so To obtain good air-tightness, in order to make the metal tube and shell to achieve air-tight sealing, in the entire sealing process, the annealing process undoubtedly plays an important role as a link between the previous and the next. The internal stress generated during KOVAR  machining also prepares the material structure for the implementation of the subsequent process-the sealing process of the metal parts. The main purpose of annealing Kovar shell before sealing is to: (1) Eliminate machining stress. When Kovar undergoes plastic machining deformation during cold working, about 10% to 15% of the applied energy is converted into internal energy, which is commonly referred to as internal stre...

Infineon FS450R07A2P2_B31

Infineon FS450R07A2P2_B31
#FS450R07A2P2_B31 Infineon FS450R07A2P2_B31 New Introduction of Infineon`s 12 inch wafer fab locations in Villach Austria and Dresden Germany in addition to Infineon's 8 inch wafer fab location in Villach Austria., FS450R07A2P2_B31 pictures, FS450R07A2P2_B31 price, #FS450R07A2P2_B31 supplier
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Email: sales@shunlongwei.com

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IGBT Module:FS450R07A2P2_B31
Please find attached our INFINEON Technologies PCN:
Introduction of Infineon`s 12 inch Wafer Fab Locations in Villach, Austria and Dresden, Germany in addition to Infineon’s 8 inch Wafer Fab Location in Villach, Austria
Important information for your attention:
 Please respond to this PCN by indicating your decision on the approval form, sign it and return to your sales
partner before 05. March 2018.
 Infineon aligns with the widely-recognized JEDEC STANDARD “JESD46“, which stipulates:
“Lack of acknowledgement of the PCN within 30 days constitutes acceptance of the change.”
Your prompt reply will help Infineon Technologies to assure a smooth and well executed transition. If Infineon does not hear from your side by the due date, we will assume your full acceptance to this proposed change and its implementation.
Your attention and response to this matter is greatly appreciated.
 

Introduction of Infineon`s 12 inch wafer fab locations in Villach Austria and Dresden Germany in addition to Infineon's 8 inch wafer fab location in Villach Austria.

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