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How to prevent deformation during slow wire processing

 Slow-moving wire processing is a very exquisite and exquisite craft, and sufficient preparations need to be made, so that the processed products can be more quality. The slow-moving wire processing technology has a wide range of applications and is a must in our industries. If you want to do better with less technology, you must master all aspects of the processing knowledge. For example, the most common thing is the deformation during processing.  How can we solve it How to prevent deformation during slow wire processing Speaking of slow wire processing, it uses continuously moving fine metal wires as electrodes. Pulse spark discharge is performed on the workpiece, where it generates a high temperature above 6000 degrees. Moreover, if it wants to improve its quality problems and prevent its deformation, it can firstly start from the following aspects. 1. To prevent deformation, it is impossible for the material to have no internal stress. In particular, the internal stress of the que

KOVAR parts seal preparation and physical properties

Kovar® is a vacuum-melted iron-nickel-cobalt low-expansion alloy. The chemical composition content is controlled in a very narrow range to ensure accurate and balanced thermal expansion performance. At the same time, strict quality control during the manufacturing process of KOVAR machining parts also ensures balance Its physical and mechanical properties are more suitable for deep drawing, stamping and various cutting processes. Material use Kovar® is used for vacuum sealing of hard glass and ceramics, and is widely used in electron tubes, microwave tubes, transistors and diodes. On integrated circuits, it is used for flat integrated circuits and dual in-line packages. Seal preparation All parts made by Kovar® should be degassed and annealed in a wet hydrogen atmosphere. Hydrogen is injected into water at room temperature and gets wet through blisters. Care must be taken to prevent surface carbonization. The heat treatment furnace must have a cooling chamber that provides the same a

What are the rules for metal stamping die scrap tube?

The Purpose Standardize the management of the scrapping of the company's metal stamping dies, prevent the loss of company assets, and formulate this system specially. Scope of application It is suitable for the management of the company's scrap molds. Definition If the molds listed in the assets of the company fall under one of the following circumstances, the use management department may apply for scrapping. 1. Molds that exceed the specified service life. 2. The mold is severely damaged by accidents or accidents, and molds that cannot be repaired or have no repair value. 3. Metal stamping dies that have not reached the service life, but due to safety, quality, efficiency and other issues, the repair still fails to meet the minimum requirements of the customer's product process or affects the production safety and efficiency. 4. Product customers have stopped placing orders or have not placed orders for molds in several years. 4. Responsibilities 1. Responsibilities of th

What is FPGA

FPGA design is not a simple chip research, but mainly uses the FPGA model to design products in other industries. Unlike ASICs, FPGAs are widely used in the communications industry. Through the analysis of the global FPGA product market and related suppliers, combined with the current actual situation in my country and domestic leading FPGA products, we can discover the future development direction of related technologies, which will play a very important role in promoting the overall improvement of my country's technological level.

FPGA
FPGA

Compared with traditional chip design, FPGA chips are not simply limited to research and design chips, but can be optimized for products in many fields with the help of specific chip models. From the perspective of chip devices, FPGA itself constitutes a typical integrated circuit in a semi-custom circuit, which contains a digital management module, an embedded unit, an output unit, and an input unit. On this basis, it is necessary for FPGA chips to focus on comprehensive chip optimization design, and to add new chip functions by improving the current chip design, thereby achieving the simplification and performance improvement of the overall chip structure.

Basic structure
FPGA device is a kind of semi-custom circuit in the application-specific integrated circuit, which is a programmable logic array, which can effectively solve the problem of fewer gate circuits in the original device. The basic structure of FPGA includes programmable input and output units, configurable logic blocks, digital clock management modules, embedded block RAM, wiring resources, embedded dedicated hard cores, and underlying embedded functional units. Because FPGA has the characteristics of abundant wiring resources, repeatable programming, high integration, and low investment, it has been widely used in the field of digital circuit design. The FPGA design process includes algorithm design, code simulation and design, board debugging, designers and actual needs to establish the algorithm architecture, use EDA to establish a design plan or HD to write design code, through code simulation to ensure that the design plan meets actual requirements, and finally board Level debugging, use the configuration circuit to download the relevant files to the FPGA chip to verify the actual operation effect.

Working Principle
FPGA adopts the concept of logic cell array LCA (Logic Cell Array), which includes three parts: Configurable Logic Block (CLB), Input Output Block (IOB) and Interconnect. Field programmable gate array (FPGA) is a programmable device. Compared with traditional logic circuits and gate arrays (such as PAL, GAL and CPLD devices), FPGA has a different structure. FPGA uses a small look-up table (16×1RAM) to realize combinational logic. Each look-up table is connected to the input of a D flip-flop, and the flip-flop drives other logic circuits or I/O to form a combination that can be realized. The logic function can also realize the basic logic unit module of the sequential logic function. These modules are connected to each other or I/O modules by metal wires. FPGA logic is realized by loading programming data into the internal static storage unit. The value stored in the memory unit determines the logic function of the logic unit and the connection between modules or between modules and I/O, and finally determines The function that FPGA can realize, FPGA allows unlimited programming.

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