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Hitachi LMG6911RPBC-E

# LMG6911RPBC-E Hitachi LMG6911RPBC-E New LMG6911RPBC KOE 5.7 inch LCM 320×240 6:1 Monochrome CCFL Parallel Data, LMG6911RPBC-E pictures, LMG6911RPBC-E price, #LMG6911RPBC-E supplier ------------------------------------------------------------------- Email: sales@shunlongwei.com https://www.slw-ele.com/lmg6911rpbc-e.html ------------------------------------------------------------------- Panel Brand:  HITACHI Panel Model : LMG6911RPBC   Panel Size : 5.7 inch Panel Type STN- LCD , LCM  Resolution: 320×240 , Q VGA   Pixel Format Rectangle Display Area: 115.17(W)×86.37(H) mm Bezel Opening 122.0(W)×90.0(H) mm Outline Size 167.1(W)×109(H) mm Brightness - Contrast Ratio 6:1 (Typ.) (TM)     Viewing Angle - Display Mode STN, Blue mode (Negative), Transmissive  IP

How to prevent deformation during slow wire processing

 Slow-moving wire processing is a very exquisite and exquisite craft, and sufficient preparations need to be made, so that the processed products can be more quality. The slow-moving wire processing technology has a wide range of applications and is a must in our industries. If you want to do better with less technology, you must master all aspects of the processing knowledge. For example, the most common thing is the deformation during processing.  How can we solve it How to prevent deformation during slow wire processing Speaking of slow wire processing, it uses continuously moving fine metal wires as electrodes. Pulse spark discharge is performed on the workpiece, where it generates a high temperature above 6000 degrees. Moreover, if it wants to improve its quality problems and prevent its deformation, it can firstly start from the following aspects. 1. To prevent deformation, it is impossible for the material to have no internal stress. In particular, the internal stress of the que

KOVAR parts seal preparation and physical properties

Kovar® is a vacuum-melted iron-nickel-cobalt low-expansion alloy. The chemical composition content is controlled in a very narrow range to ensure accurate and balanced thermal expansion performance. At the same time, strict quality control during the manufacturing process of KOVAR machining parts also ensures balance Its physical and mechanical properties are more suitable for deep drawing, stamping and various cutting processes. Material use Kovar® is used for vacuum sealing of hard glass and ceramics, and is widely used in electron tubes, microwave tubes, transistors and diodes. On integrated circuits, it is used for flat integrated circuits and dual in-line packages. Seal preparation All parts made by Kovar® should be degassed and annealed in a wet hydrogen atmosphere. Hydrogen is injected into water at room temperature and gets wet through blisters. Care must be taken to prevent surface carbonization. The heat treatment furnace must have a cooling chamber that provides the same a

KOVAR parts cold working manufacturing process

KOVAR parts are precision processed by CNC numerical control machine tools and used for electronic industry equipment; precision parts processing, swiss machining, CNC precision parts processing.



(1) Eliminate machining stress.

When Kovar undergoes plastic deformation during cold working, about 10% to 15% of the applied energy is converted into internal energy, which is commonly referred to as internal stress, so that the Kovar machining material structure is in an unstable state. Under this condition, it can be maintained for a long time without significant changes.

Once it is heated, a series of changes in structure and properties will occur, and the material structure tends to a stable state. This change in structure and properties, especially changes in the structure of the structure, is reflected on the sealing surface.

The tensile stress on the molybdenum group glass during high temperature sealing may cause the glass to produce small cracks and leak air.

(2) Eliminate work hardening.

In the process of cold working, cnc manufacturing and forming of Kovar parts, due to defects such as grain elongation and grain breakage in the internal material structure, crystal defects and dislocation density increase greatly. The smaller the distance between the dislocation and the dislocation, the greater the interference between each other, and the greater the distortion of the surrounding lattice.

Each dislocation line has a stress field, and the dislocation and dislocation pass through each The interaction of the stress field causes the hardness and elasticity of Kovar to increase, while the plasticity decreases, which is work hardening.

If the work hardening is not eliminated, the stress field of the interaction between dislocations and dislocations will be broken due to crystal recovery or recrystallization during high-temperature sealing, and the balance will be lost. This also affects the sealing of alloy machining and glass. Certain stress effects.

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